下一代超薄型光盘半片的注塑——TCM技术

Molding process of next generation super thin half substrate-TCM technology

本文就最新的超薄型光盘半片射出成型的要求, 来简介三种薄型器件注塑模具设计的改进原理,并且探讨有关主动式“热循环注塑”(TCM)运用的可能。

Molding technology has been evolved with new materials and an innovated heating-cooling method known as Thermal Cyclic Molding (TCM). This paper gives a preview of the TCM technology and all other related methods to achieve the molding for substrates with a thickness less than 0.6mm.