TiC含量对W-30Cu/TiC复合材料显微结构和性能的影响（英文）

Influence of TiC Content on Microstructure and Properties of W-30Cu/TiC Composites

经简化预处理后,采用化学法制得W-30Cu/xTiC(x=0~4,质量分数%)复合粉末,在400 MPa压力下,将制得的复合粉末压制成毛坯块体试样,随后在1300℃下烧结1 h制得块体复合材料试样。采用场发射扫描电镜来表征原始W和TiC粉末、预处理后的W和TiC粉末、化学法制得的W-30Cu/xTiC(x=0~4)复合粉末的显微形貌,以及制得的W-30Cu/TiC复合材料的显微结构。对不同TiC含量对W-30Cu/TiC复合材料性能(相对密度、硬度、导电性和抗弯强度等)进行研究。结果表明:对简单预处理后的W、TiC粉末化学镀Cu所获得的W-30Cu/TiC复合粉末的显微结构均匀。TiC含量低于1%时,W-30Cu/TiC复合材料的抗弯强度和硬度随TiC含量的增加而显著增大。而导电性则随TiC含量增加而减小,但仍高于国家标准值。添加一定量的TiC有利于获得综合性能较好的W-30Cu/TiC复合材料。

W-30 Cu/xTiC（x=0～4, wt%） composite powders were prepared by electroless plating with simplified pretreatment. The composite powders were formed by cold compaction under 400 MPa using a tablet machine and green compactions were sintered at 1300 ℃ for 1 h. Micromorphology of the original W and TiC powders, simple-treated W and TiC powders, and as-received W-30 Cu/xTiC（x=0～4） composite powders after electroless plating were characterized by field emission scanning electron microscopy（FE-SEM）. Microstructures of the W-30 Cu/x Ti C（x=0～4） composites were also investigated by FE-SEM. The effect of TiC content on the properties of W-30 Cu/xTiC（x=0～4） composites（such as relative density, hardness, electrical conductivity, and compressive strength） were studied. Results show that W-30 Cu/TiC composite powders with uniform structure are obtained by simplified W and TiC powder pretreatment, followed by electroless copper plating. When TiC content is less than 1 wt%, the compressive strength and hardness of composite materials obviously increase and the electrical conductivity of composite materials decreases with TiC content increasing. However, the electrical conductivity of composite materials is still higher than that of the national standard value. With a certain amount of TiC content to W-30 Cu/xTiC（x=0～4） composites, the composites exhibit good comprehensive performance.