一种高性能红外接收芯片的设计

Design of an infrared receiver chip

文章阐明了一种高性能红外接收芯片的设计方法,描述了其中主要模块包括前置放大器、自动增益控制电路、可修调中心频率的带通滤波器和自动增益控制电路的设计要点。芯片使用Cadence的设计软件设计并绘制版图流片。本芯片采用0.5 2P2M CMOS工艺制造,面积为0.79*0.76,芯片工作电压为2.7V到5.5V,典型功耗为1.55mW。在无光干扰的情况下最远接受距离达43米,超过市面同类产品的性能。对于市面上常见荧光灯,在距离光源30cm处芯片的最远接收距离也可达到10米以上。

This paper presents the design of a high-performance infrared receiver chip, Specially, the important parts of the chip, including the pre-amplifier, Variable gain amplifier, band-pass filter which center frequency adjustable and automatic gain control circuit. This chip uses Cadence＇s design tool to design and layout, The chip is fabricated using 0.5μm 2P2M CMOS process and it occupies smallest size of 0.79 mm x 0.76 mm, It operates on 2.7 V to 5.5 V and consumes low power of 1.55. With no light interference, the farthest distance the chip can work is 43 meters, much longer than similar products on the market. With common fluorescent lamps in 30 cm away, the farthest distance the chip can work is more than 10 meters.