压电双材料界面裂纹的强度因子分析

Analysis of intensity factors of interface crack in piezoelectric bimaterials

为满足实际工程中对求解压电双材料界面裂纹强度因子方法通用性和有效性的要求,基于压电界面断裂力学推导了压电双材料平面及反平面界面裂纹强度因子显示外推公式,通过力电耦合有限元模拟了裂纹尖端附近的位移场和电场,将裂纹尖端后面的裂纹张开位移和电势跃变代入强度因子显示外推公式,求解压电双材料的界面裂纹强度因子。以含中心裂纹压电双材料板为例,对不同载荷、单元数和加密形式下的强度因子进行了讨论,并与解析解作了对比。数值算例结果表明,本文方法具有计算简单、精度高等优点。

In order to meet the requirement of commonality and effectiveness in solving the intensity factors of piezoelectric bimaterials with interface crack in practical engineering,based on piezoelectric interface facture mechanics,an explicit extrapolating formula of intensity factors for in-plane and antiplane interface crack was derived.The interface crack-tip displacement field and electric filed of the piezoelectric bimaterials were simulated using the electromechanical coupling computation methods.Substituting the crack displacement and the electric potential jump at the back of the crack tip into the explicit extrapolating formula,the intensity factors of piezoelectric bimaterials with interface crack were solved.Considering a center interface crack in double piezoelectric plates,the intensity factors under different loadings,different numbers of elements,and different mesh refinement methods were discussed and compared with the analytical solution.Results of numerical examples show that the proposed method has the advantages of simple calculation and high accuracy.