铝合金/不锈钢层状复合材料界面化合物生长行为

Growth behavior of intermetallic compounds of aluminum alloy/stainless steel composite

采用光学显微镜（OM）、X射线衍射仪（XRD）、扫描电镜（SEM）和能谱（EDS）研究了轧制复合铝合金/不锈钢（4A60/304、4A60/316、4A60/430、4A60/439、1050/304、1050/304）复合界面金属间化合物的生长行为。结果表明：4A60铝合金/不锈钢复合界面靠近铝侧存在Si元素富集区、4A60/316不锈钢复合界面靠近铝侧存在Ni元素富集区;当热处理温度为575℃时,4A60/316界面化合物生长常数最小为2.56×10-14m2/s,1050/304界面化合物生长激活能最低为95.94 kJ/mol;界面金属间化合物主要为Fe2Al5相,还可观察到FeAl3、Fe4Al13相。

The growth behavior of intermetallic compounds（IMC） at the interface of rolling bonded aluminum alloy/stainless steel clad plates（4A60/304,4A60/316,4A60/430,4A60/439,1050/304,1050/304） was investigated by means of optical microscope,scanning electron microscopy,energy dispersive spectrometer analysis and X-ray diffraction.The results show that there is Si enrichment area near the 4A60 aluminum alloy（Si0.8%）/stainless steel composite interface at the aluminum side,and there is Ni enrichment area near the 4A60 aluminum alloy/316 stainless steel composite interface at the aluminum side.When the heat treatment temperature is 575 ℃,the growth constant k of IMC at the interface of 4A60/316 is minimum with the value of 2.56 × 10-14 m2/s,and the growth activation energy of IMC at the interface of 1050/304 is the lowest（about 95.94 kJ/mol）.The IMC at the interface of aluminum alloy/stainless steel clad plates is mainly Fe2Al5 phase,with a small amount of Fe4Al13 phase and FeAl3 phase.