摘要
研究了纳米Ag颗粒对Sn-0.7Cu-x Ag钎料组织和性能的影响。结果表明：在Sn-0.7Cu钎料中加入适量的纳米Ag颗粒可以改善钎料的润湿性。当Ag含量为2%时,润湿性最好,铺展系数可以达到74.66%。添加微量的Ag增加了钎料的形核率,细化了钎料的微观组织。但是Ag含量过多时IMC层厚度大。当Ag含量为4%时,钎料的显微硬度最大,其焊点抗拉强度最大,焊点抗拉强度为55.69 MPa。当Ag含量为8%时,钎料的IMC层厚度最大,达到3.88μm,其焊点的抗拉强度最小。
The effects of nano Ag particles on the microstructure and properties of Sn-0.7 Cu-x Ag solders were studied.The results show that adding proper nano Ag paticles to Sn-0.7 Cu solder can improve the wettability of the solder. When the Ag content is 2%, the wettability is the best and the spreading coefficient can reach 74.66%. Adding small amount of Ag paticles increases the nucleaction rate and refines the microstructure of the solder. When the Ag content is too high, the IMC thickness increases. When the Ag content is 4%, the microhardness of the solder is the biggest, and the tensile strength of the solder joint is the best, which is 55.69 MPa. When the Ag content is 8%, the IMC layer＇s thickness is the biggest, which is 3.88μm, and the tensile strength of the solder joint is the smallest.
作者
戴军
刘政
杨莉
张尧成
薛明川
贾震
邱光怀
DAI Jun1, LIU Zheng2, YANG Li1, ZHANG Yaocheng1, XUE Mingchuan1 JIANG Zhen1, QIU Guanghuai3(1.,School of Automotive Engineering, Changshu Institute of Technology, Changshu 215500, China; 2. School of Modem Technology, Suzhou Top Institute of Information Technology, Kunshan 215311, China; 3. Chinalco Rare Earth （Jiangsu） Co., Ltd., Changshu 215500, China)
出处
《热加工工艺》
CSCD
北大核心
2018年第3期33-36,共4页
Hot Working Technology
基金
国家自然科学基金青年基金项目(51505040)
江苏省自然科学基金面上项目(SBK2014020827)
江苏省“青蓝工程”资助项目(SZ2016002)
江苏省大型工程装备检测与控制重点建设实验室开放课题资助项目(JSKLEDC201507)
