摘要
以芯片级封装（CSP）器件的焊点作为研究对象,选用Sn96.5Ag3.0Cu0.5（SAC305）、Sn98.5Ag1.0Cu0.5（SAC105）、Sn63Pb37和Sn99.3Cu0.7等四种焊料制备CSP器件,研究了在热循环冲击前后CSP器件焊点的显微组织和电阻值变化率,以及热等温时效不同时间后不同焊料焊点的耐热疲劳性能。最后从设计与实际生产工艺角度提出改善电子产品耐热寿命的办法。
Taking the solder joints of chip level packaging（CSP） devices as the research object, CSP devices were prepared by using four kinds of solders such as Sn96.5 Ag3.0 Cu0.5（SAC305）, Sn98.5 Ag1.0 Cu0.5（SAC105）, Sn63 Pb37 and Sn99.3 Cu0.7. The microstructure and resistance change rate of CSP solder joints before and after thermal cycle impact were investigated, and the thermal fatigue resistance of different solder joints after thermal isothermal aging for different time was also investigated. Finally, from the point of design and actual production process, the method to improve the heat resistance life of electronic products was put forward.
作者
朱桂兵
刘智泉
ZHU Guibing1,2, LIU Zhiquan3(1. Nanjing College of Information and Technology, Nanjing 210023, China; 2. School of Physical ＆ Material Science Anhui University, Hefei 230039, China; 3. Department of Mechanical Engineering, Hong Kong University of Science and Technology, Hongkong 999077, Chin)
出处
《热加工工艺》
CSCD
北大核心
2018年第3期237-240,248,共5页
Hot Working Technology
基金
南京信息职业技术学院副高重点科研基金项目(YK20160203)
江苏省“青蓝工程”项目资助(JSQL2017-06)
关键词
热循环测试
等温时效
芯片级封装
可靠性
SAC焊点
thermal cycle testing
isothermal aging
chip level package
reliability
SAC solder joint
