传感器支架的封装特性研究探讨

Discuss on Packaging Characteristics of Sensor Support

本文主要探讨传感器支架带来的产品固设结构变化,研究接触特性上传感器响应时间的影响,和连接特性上敏感元件置中隔离的多重绝缘防护。结果表明,传感器支架的合理设计可以实现传感器响应时间不超过16 s、168 h高温蒸煮后的绝缘电阻大于2 MΩ。

This paper mainly discusses the change of product＇s solid structure caused by sensor supporting parts, studies the influence of sensor response time on contact characteristics, and multiple insulation protection on the connection characteristics of sensors. The results show that the reasonable design of the sensor support can achieve the response time of the sensor not more than 16 s, and the insulation resistance of 168 h after high temperature cooking is greater than 2 MΩ.