适用于高密度封装的失效分析技术及其应用

Failure Analysis Technology for High Density Packaging and Its Application

高密度封装技术在近些年迅猛发展,同时也给失效分析过程带来新的挑战。常规的失效分析手段难以满足结构复杂、线宽微小的高密度封装分析需求,需要针对具体分析对象对分析手法进行调整和改进。介绍了X射线、计算机辅助层析成像（CT）技术、微探针和多方法联用等失效分析技术,分析了其原理和适用于高密度封装的优势。并结合两个高密度封装失效分析案例,具体介绍了其在案例中的使用阶段和应用方法,成功找到失效原因。最后总结了各方法在高密度封装失效分析中应用的优势、不足和适用范围。

High density packaging technology has been developed rapidly in recent years,which also brings new challenges to the failure analysis process. Common failure analysis methods are difficult to meet the requirements of high density packaging analysis with complex structure and small linewidth. In this case,it is necessary to adjust and improve the analysis methods according to the specific analysis objects. Several failure analysis technologies including X-ray,computed tomography（ CT） technology,microprobe and multi-method combination were introduced,and their principles and advantages in high density packaging were analyzed. The usage phases and application methods in the cases were introduced in detail by combining with two cases of high density packaging failure analysis,thus succeeded in finding out the failure cause. Finally,the advantages,shortcomings and application scope of various methods used in the failure analysis of high density packaging were summarized.