爆炸压涂钨铜覆层到铜表面的研究

Explosive Compact-coating Tungsten Copper Alloy to Copper Surface

采用爆炸烧结将钨铜合金覆层烧结到纯铜表面的方法,即将钨铜合金粉末预压到铜板的表面后,进行通氢烧结,然后通过爆炸压实将混合粉末进一步压实在铜板表面,最后扩散烧结成为钨铜复合材料。先采用AUTODYN软件模拟了爆炸压实过程中粉末与铜板中的压力分布,确定了一套可以使覆层粉末中压力分布均匀,有利于钨铜合金粉末均匀致密化的参数。而后进行爆炸压实试验,制出的试样覆层密度达到了理论密度的99.3%。对爆炸后的试件进行电子探针检测,检测结果表明钨铜粉混合均匀,钨颗粒的尺寸比铜颗粒要大的多。断口分析结果显示,钨铜覆层的断口形貌不同于传统的断口形貌。钨铜结合面的形貌分析表明,钨铜合金密实的烧结在了铜基体的表面。

This paper proposed a new method to sinter tungsten-copper alloy onto copper plate surface by explosive-compact-coating. Its steps included pre-compacting tungsten-copper alloy powder onto copper plate surface, sintering in the hydrogen, then compacting the powder by detonation pressure to ensure the strong bonding between the coating and substrate, and finally diffusion sintering. We simulated the compressing process of explosive compaction by the commercially available package AUTODYN and determined the processing parameters which could cause uniform distribution of pressures in the coating powder and uniform densification of alloy powder. Then we conducted the explosive-compacting experiments. Results show that the density of the coating layer reaches up to 99.3% of the theoretical value using the parameters in simulation. Microstructure characteristics indicate that tungsten-copper alloy powder mix well. The tungsten particles are much larger than copper particles. The SEM fracture morphology of the tungsten-copper coating layer is different from traditional fracture. The joint surface of tungsten-copper and copper demonstrates that tungsten-copper alloy is compactly sintered on the surface of the copper.