电沉积枝状微针翅铜的池沸腾传热特性

Pool Boiling Performance of Electrodeposited Copper Micro Dendrite Arrays

微纳表面在沸腾传热领域得到广泛的关注和研究。本文通过电化学沉积方法制备了枝状微针翅铜表面,并测试了其池沸腾换热特性。实验表明,在较低热流密度时,样品厚度对沸腾强化效果的影响不明显;但热流密度较大时,沸腾强化效果随样品厚度的减小而增大,其中厚度为110μm的样品在热流密度为140 W·cm^(-2)时,有最大传热系数143kW·m^(-2)·℃^(-1)。CHF随样品厚度增大而增大,厚度为460μm时的CHF约250 W·cm^(-2)。

Micro/nano structure has been widely investigated in heat transfer field. Herein, copper vertical micro dendrite fin arrays is fabricated by electrochemical method, and their pool boiling performance is tested. The results show that, there is no obvious effect of copper dendrite height on the boiling performance at low heat flux. However, the boiling performance decreases with dendrite height at high heat flux, and the maximum heat transfer coefficient is 143 kW.m-2 . ℃-1 at 140 W.cm-2 for the sample with dendrite height of 110 μm. The critical heat flux （CHF） increases with the dendrite height, and the highest CHF is 250 W.cm-2 for the sample with dendrite height of 460 μm.