靶基距对杂化离子镀TiCN薄膜结构和性能的影响

Effects of target-substrate distance on structure and properties of TiCN thin films by hybrid ion plating

以基底与溅射碳靶之间的距离(靶基距)为变量参数,采用杂化离子镀技术在高速钢、硅片以及不锈钢片表面制备Ti CN薄膜。用X射线衍射仪、扫描电子显微镜、维氏硬度计、XP-2台阶仪分别对薄膜的物相结构、表面形貌、显微硬度、沉积速率进行表征,研究了靶基距对薄膜结构和性能的影响。结果表明,所制备的Ti CN薄膜具有晶体结构,膜层沿Ti CN(220)晶面择优生长;靶基距的增加会使薄膜的沉积速率逐渐增快,但薄膜中C的掺杂量、显微硬度则会随之下降,表面质量也不断变差。

The Ti CN thin films were deposited on high-speed steel, silicon slices and stainless steel by hybrid ion plating,with target-substrate distance varied as a parameter. The crystalline structure, surface morphology, hardness and deposition rate of the films were characterized by XRD, SEM, Vicker＇stester, and profiler, respectively. Effects of target-substrate distance on structure and mechanical properties of the Ti CN films were analyzed and discussed. The results show that all the as-deposited Ti CN films are crystalline with the preferred（ 220） plane. As the target-substrate distance increases, the film deposition rate increases, but the account of doped C and micro-hardness as well as surface quality of the films decrease.