同轴-环形TSV电学性能

Electrical Characteristics of Coaxial-Annular Through Silicon Via

针对性能优越的同轴-环形硅通孔（Coaxial-Annular Through Silicon Via,CA-TSV）结构,提出特征阻抗、功率、时间常数及寄生参数的解析模型,研究结构参数对电学特性的影响,并通过HFSS软件对S21参数进行验证.结果表明：增加CA-TSV的内径或减小其外径可以有效减小特征阻抗,而减小其内径或增加其外径可以有效减小功率;增加CA-TSV的内径或外径可以有效减小RC等效电路的时间常数,而增大其内径或减小其外径可以有效减小RL等效电路的时间常数;增加CA-TSV的内径或外径可以有效减小电阻并且可以使电容值显著提高.

For coaxial-annular through silicon vias（CA-TSV） structure with superior performances,characteristic impedance,power,time constant and analytical models of parasitic parameters are proposed and effects of structural parameters on electrical properties are studied. S21 parameter was verified by software HFSS. It shows that increasing inner diameter of CA-TSV or reducing outer diameter reduces characteristic impedance,while reducing inner diameter of CA-TSV or increasing outer diameter reduces its power consumption effectively. Increasing inner diameter of CA-TSV or outer diameter reduces time constant of RC equivalent circuit,whereas increasing inner diameter of CA-TSV or reducing outer diameter reduces time constant of RL equivalent circuit. Increasing inner diameter of CA-TSV or outer diameter reduces resistance effectively and capacitance can be increased significantly. It provides reference for electrical properties of three-dimensional integrated circuits based on TSV interconnects.