高热导率纳米银胶在大功率器件上的应用

Application of the High Thermal Conductivity Nano-Silver Adhesive in High Power Devices

对高热导率纳米银胶进行了性能分析,并与Au80Sn20焊料进行了对比;将其应用于一大功率器件,通过对粘结芯片进行剪切力测试,验证了纳米银胶具有可靠的连接强度;调整粘结样品的键合参数,并对键合丝进行拉力测试,结果在正常范围内;对器件进行热阻测试,与Au80Sn20焊料烧结对比,温度分布基本一致;进一步进行各项电性能测试,器件各参数正常。各项结果表明,此纳米银胶可替代Au80Sn20焊料烧结,应用于大功率器件上。

The performances of the high thermal conductivity nano-silver adhesive were analyzed and compared with those of the Au80Sn20 solder.The nano-silver adhesive was used in a high power device,and the shearing strength of the bonded chip was tested to validate the reliable connection strength of the nano-silver adhesive.Then the bonding parameters of the sample bonded by the nano-silver adhesive ware adjusted,and the pulling force of the bonded wire was tested.The results show that the pulling force is in the normal range.Besides,the thermal resistance of the device was tested and the result was compared with that of the sample soldered by Au80Sn20.The temperature distributions were almost identical.Furthermore,various electrical properties were tested,and all the parameters were in the normal range.All the results indicate that the nano-silver adhesive can replace Au80Sn20 solder to be applied for a high power device.