摘要
归纳总结了单晶硅片表面玷污杂质的来源和分类、清洗检验的工艺和清洗检验的设备,并对单晶硅清洗检验的发展趋势进行了分析。
Summarizes the origin and classification of silicon wafer surface contamination,cleaning process and cleaning inspection of the equipment,and the development trend of silicon cleaning inspection are analyzed.
作者
王玲玉
WANG Lingyu(The 46th Research Institute of CETC, Tianjin 300220, Chin)
出处
《电子工业专用设备》
2018年第2期27-33,共7页
Equipment for Electronic Products Manufacturing
关键词
单晶硅
清洗
检验
工艺
Monocrystalline silicon
Cleaning： Inspectiom Process
