透波性Si_3N_4陶瓷铣削加工表面边缘破损实验研究

Investigation on Edge Chipping of Wave-Transmitting Si_3N_4 Ceramics in Milling

针对透波性Si_3N_4陶瓷铣削加工过程中易出现边缘破损现象,通过不同铣削深度实验研究了边缘破损类型、产生位置以及切深对边缘破损影响,并分析了边缘破损产生机理,最后提出了边缘破损控制方法。结果表明:当切深为0.4~0.8 mm时,边缘破损主要集中于出口棱边和入刀侧边;且脆性域加工过程中随着切深的增加,边缘破损程度呈现增大趋势;降低切深至≤0.3 mm且采用跟随周边走刀方式,并保证入刀处刀尖线速度方向与进给方向夹角不小于90°,可以有效控制边缘破损。研究为提高透波性Si_3N_4陶瓷铣削加工表面质量提供了技术支撑。

Edge chipping of wave-transmitting ceramics in milling is prone to be presented, so the type, location of edge chipping has been investigated with different cutting depth experiments. The effect of cutting depth on edge chipping and the mechanism have also been analyzed. Finally, edge chipping control methods have been proposed. The results show that the edge chipping is mainly concentrated at the exit seamed edge and the entrance side edge of the milling tool when the depth is from 0.4mm to 0.8mm. With the increasing of cutting depth in brittle domain machining, the edge chipping is added. One way of controlling edge chipping is to reduce the cutting depth to no more than 0.3mm, another way is to using the tool path planning method of follow periphery, and ensure that the angle between speed direction and the feed direction is not less than 90°. The investigation provides technical support to improve the surface of the wave-transmitting Si3 N4 ceramics in milling.