印制板固化程度分析及改善

Analysis and improvement of PCB curing degree

固化程度是考核多层印制板生产质量的一个重要指标。多层板层压是影响固化程度的一项重要工艺,本文将着重从层压工艺进行分析,并通过实验得出各层压参数对固化度的影响,最终提出相应的改善方案意图提高固化程度。

The degree of curing is an important index of the production quality of multilayer PCB. Lamination is an important process affecting curing degree. This paper focuses on the analysis of the lamination process and the influence of each lamination parameter on curing degree. Finally, the corresponding improvement plan is proposed to improve the curing degree.