特殊结构局部混压工艺研究

Research on process of special inlay design

局部混压PC B设计越来越复杂化。本篇论文对几种不同复杂结构设计的局部混压工艺进行进一步研究,成功开发出高频子板L2对应FR 4 PP层间、高频子板L2对应FR 4芯板之间等多种复杂结构的局部混压工艺,各项关键指标均已满足要求,如可靠性可耐受4次无铅回流及6次热应力测试,交界位平整度≤10 mm。

Today there are more and more complicated inlay designs for PCB. This paper studies the process of various complicated inlay stack-up design such as high frequency unit embed in the FR4 core or prepreg and the ground layer of high frequency unit which is in the plane as the odd layers of FR4. The thermal reliability performance could undergo 4 cycles lead-free reflow test and 6 cycles lead-free thermal stress test. The flatness is less than 10 pro, and other test could all meet the requirements.