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Characterization of Ti-Cu Films Deposited by HPPMS and Effect on NO Catalytic Release and Platelet Adhesion Behavior

Characterization of Ti-Cu Films Deposited by HPPMS and Effect on NO Catalytic Release and Platelet Adhesion Behavior
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摘要 Ti-Cu films with different Cu concentrations were fabricated by high-power pulsed magnetron sputtering(HPPMS) to release copper ions and catalyze NO to improve the blood compatibility. The Cu concentrations of films were 25.7 at% and 68.8 at%. Pure Ti films were also fabricated. Copper release, catalytic release of nitric oxide(NO), and blood platelet adhesion of Ti-Cu films were studied. Ti-Cu films released copper ions in PBS solution and more Cu ions were released from films with 68.8 at% Cu. Ti-Cu films had excellent ability of catalytical decomposition of exogenous donor S-nitroso-N-acetyl-DL-penicillamine(SNAP) and as a result, nitric oxide(NO) was generated. The NO generation catalyzed by Ti-Cu films was significantly higher than that by pure Ti films. This was more eminent in the Ti-Cu films with 68.8 at% Cu. The platelet adhesion and activation of Ti-Cu films were significantly inhibited compared to that of pure Ti films in the presence of SNAP. The Ti-Cu film fabricated by HPPMS showed the ability of releasing Cu ions to catalyze SNAP to generate NO to inhibit platelet adhesion and activation. Ti-Cu films with different Cu concentrations were fabricated by high-power pulsed magnetron sputtering(HPPMS) to release copper ions and catalyze NO to improve the blood compatibility. The Cu concentrations of films were 25.7 at% and 68.8 at%. Pure Ti films were also fabricated. Copper release, catalytic release of nitric oxide(NO), and blood platelet adhesion of Ti-Cu films were studied. Ti-Cu films released copper ions in PBS solution and more Cu ions were released from films with 68.8 at% Cu. Ti-Cu films had excellent ability of catalytical decomposition of exogenous donor S-nitroso-N-acetyl-DL-penicillamine(SNAP) and as a result, nitric oxide(NO) was generated. The NO generation catalyzed by Ti-Cu films was significantly higher than that by pure Ti films. This was more eminent in the Ti-Cu films with 68.8 at% Cu. The platelet adhesion and activation of Ti-Cu films were significantly inhibited compared to that of pure Ti films in the presence of SNAP. The Ti-Cu film fabricated by HPPMS showed the ability of releasing Cu ions to catalyze SNAP to generate NO to inhibit platelet adhesion and activation.
出处 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2018年第2期505-511,共7页 武汉理工大学学报(材料科学英文版)
基金 Funded by the National Natural Science Foundation of China(No.31300787) the National Natural Science Foundation of China China Academy of Engineering Physics(NSAF No.U1330113) the Overseas Famous Teacher Program of Chinese Education Ministry(MS2010XNJT070) the Qingmiao Plan of SWJTU 2015(No.A0920502051517-6)
关键词 Ti-Cu film copper ions nitrogen oxide platelet adhesion high-power pulsed magnetron sputtering Ti-Cu film copper ions nitrogen oxide platelet adhesion high-power pulsed magnetron sputtering
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