超细晶纯铜切屑热挤压成型工艺研究

Study on Hot Extrusion Forming Process of Ultrafine Grain Pure Copper Chips

研究了在纯铜超细晶切屑的挤压成型过程中温度对晶粒的影响。结果表明,在热挤压后,超细晶纯铜切屑的晶粒组织受到热作用的影响很小,虽然晶粒有所长大,但是依旧属于超细晶范畴。纯铜棒料经过热挤压制成圆棒后,横截面上的晶粒长大程度大于纵截面,挤压过程中材料的变形起到了抑制晶粒长大的作用。随着挤压温度的升高,挤压后的材料显微硬度减小,致密度增大。

The influence of the temperature on grains during the hot-extrusion forming of ultrafin grain pure copper chips was studied. The results show that after hot extrusion, the effect of heating on the grain microstructure of ultrafine grain pure copper chips is very small. Although the grains have grown up, they still belong to the category of ultrafine crystals. The grain growth extent in the cross section of the pure copper bar after hot-extrusion is greater than that of the longitudinal section. The deformation of the material plays a role in inhibiting grain growth during extrusion. With the increase of extrusion temperature, the hardness of the extruded material decreases and the density increases.