热超声金丝键合工艺及其可靠性研究

Investigation on the Thermal Ultrasonic Gold Wire Bonding Technology and Reliability of Interface

采用单一变量法,研究了超声功率、超声时间和焊接压力对金丝球焊时金丝引线结合性能的影响,以及键合引线在不同测试温度和不同老化时间下的结合性能,并通过对键合界面的研究分析了影响界面可靠性的原因。研究结果表明,相比于超声功率和超声时间,焊接压力对金丝引线结合性能的影响最大,随着焊接压力的增大,金丝球焊第一焊点的剪切断裂载荷以及金丝引线的拉伸断裂载荷均增加;随着测试时基板加热温度的升高,金丝球焊第一焊点的剪切断裂载荷以及金丝引线的拉伸断裂载荷均逐渐降低。150℃老化试验结果表明,随着老化时间延长,金丝球焊第一焊点的剪切断裂载荷以及金丝引线的拉伸断裂载荷均呈现先增大后减小的规律。

Using a single variable method,this study investigates the effects of ultrasonic power,ultrasonic time and welding pressure on bonding performance of gold ball bonding,and bonding property of bond leads at different test temperatures and different aging times.The factors that affect the interface reliability are analyzed by the study of bonding interface.It is found that the welding pressure has the most significant influence on the bonding performance compared with the ultrasonic power and ultrasonic time.The test results show that with the increase of welding pressure,the shearing force of the first bonding and the pulling force of Au wires are all on the rise;with the increase of heating temperature,the shearing force of the first bonding and the pulling force of Au wires are all gradually decreased.Aging at 150℃shows that with the increase of aging time,the shearing force of the first bonding and the pulling force of Au wires are increased first and then decreased.