多层薄膜沉积的应力仿真分析

Stress Simulation Analysis of Multilayer Film Deposition

提出了一种薄膜本征应力的模拟方法,数值仿真分析了多层薄膜沉积过程中的热应力和本征应力。通过引入本征应力系数,并借助现有的热应力有限元分析程序,模拟了薄膜的本征应力,并从理论上证明了该方法的合理性。采用模型重构-应力初始化的方法模拟了材料增长,建立了多层薄膜应力分析模型。工程实例分析结果表明,采用该方法和流程可以方便地模拟出多层薄膜在每个沉积阶段的本征应力和热应力。

A method for simulating the intrinsic stress of thin films is proposed, and the thermal stress and the intrinsic stress of the multilayer films during the deposition process are numerically analyzed. By introducing the intrinsic stress coefficients and using the existing thermal stress finite element analysis program, the intrinsic stress of the films is simulated, and the correctness of this method is verified from a theoretical perspective. The growth of materials is simulated by using the model reconstruction and stress initialization method. The stress analysis model of multilayer films is established. The analysis results from the engineering examples indicate that the intrinsic stress and thermal stress of the multilayer films at each deposition stage can be conveniently simulated by using this method and procedure.