树脂结合剂金刚石切割线的树脂层性能分析

Analysis on Properties of Resin Bonded Diamond Cutting Line Resin Layer

针对树脂结合剂金刚石切割线树脂层强度和硬度低等问题,对树脂混合液固化后的性能进行了研究。通过正交试验,以剪切强度为指标,确立了最佳固化温度和固化时间。当树脂固化温度为180℃(60min)时的固化工艺下树脂粘结性能最优。制备了树脂金刚石切割线,进行了锯切试验,试验表明:制备的树脂金刚线性能较优,切片质量较好。

In order to overcome deficience of the strength and hardness of the resin layer of resin bonded diamond cutting line,the resin layer is studied. The curing temperature and curing time are optimized,according to the shear strength,the optimal scheme is established by orthogonal test. When the curing temperature is 180℃,the curing time is60 min,the resin bond strength is the best. The resin diamond cutting line is made and the cutting experiment is carried out.The experiment shows that the resin diamond cutting line performance and slicing quality are better.