高导热低填量聚合物基复合材料研究进展

Review of polymer-based composites with high thermal conductivity and low filler loading

高导热低填量聚合物基复合材料在电子封装和大功率电子设备等领域有着巨大需求。通常高导热聚合物是通过在高分子基体中均匀分散高含量的导热填料来实现的,然而较高填料含量会极大地恶化复合材料力学性能和提升材料经济成本,因此高填量复合材料很难满足当前工业应用上的需求。综述了近年来高导热低填量聚合物基复合材料制备研究进展,简要介绍了导热机制和影响低填量聚合物基复合材料导热性能的主要因素,按照不同填料类型介绍了一些热导率高于1.0 W/(m·K)且填充量低于10vol%的高导热低填量聚合物基复合材料的制备方法和研究进展,展望了高导热低填量聚合物基复合材料的发展方向。

The demands of polymer-based composites with high thermal conductivity and low filler loading are significant in many applications such as electronic packaging and high-power electronic equipment.In general,the enhanced thermal conductivity requires dispersed filler with high loading in polymer matrix.However,the large amount of fillers usually results in the large degradation of mechanical property and high cost,which will lead to the composites difficult to meet the demands of present industrial applications.In this review,the current research progress on polymer-based composites with high thermal conductivity and low loading was discussed.Its thermal conduction mechanism and some factors,which primarily affected the thermal conductivity of composites,were recommended.And some methods that were used in preparing polymer-based composites with a thermal conductivity over1.0 W/（m·K） and a low filler loading below 10vol%,were introduced according to different filler type.The challenges and outlook for polymer-based composites with high thermal conductivity and low filler loading were outlined.