期刊文献+

模压工艺参数对聚酰亚胺树脂压缩强度的影响及其数学模型的建立

Influence of molding process parameters on compressive strength for polyimide resin and establishment of mathematical model
下载PDF
导出
摘要 研究了模压温度、保温时间对聚酰亚胺树脂强度的影响,并建立了这些工艺参数与树脂强度的数学模型.研究结果表明,热压成型过程中的成型工艺会显著影响聚酰亚胺树脂的强度.当成型温度为653 K、无压力时的保温时间为25 min时,聚酰亚胺树脂的压缩强度达到最大值.通过正交中心复合设计,拟合得到的多元二次方程式可以在研究范围内充分描述聚酰亚胺树脂的压缩强度特性. Influence of molding temperature and duration time on the strength of polyimide were investigated, and a mathematical model was established. The results indicate that the pressing parameters have significant effects on the strength of polyimide. The compressive strength reaches maximum when the molding temperature is 653 K and nonpressure duration time is 25 min. Besides, a fitted quadric multiple equation is obtained with orthogonal central composite design. It can fully characterize compressive strength of polyimide within the research domain.
作者 方琳 BURYA A I 俞鸣明 任慕苏 KALINICHENKO C B EREMINA E A FANG Lin;BURYA A I;YU Mingming;REN Musu;KALINICHENKO C B;EREMINA E A(Research Center for Composite Materials, Shanghai University, Shanghai 200072, China;Dnepropetrovsk State Agrarian University, Dnepropetrovsk 49027, Ukraine)
出处 《上海大学学报(自然科学版)》 CAS CSCD 北大核心 2018年第2期272-277,共6页 Journal of Shanghai University:Natural Science Edition
关键词 聚合物 成型 压制 工艺参数 温度 保温时间 数学模型 polymers molding pressing process parameters temperature duration time mathematical model
  • 相关文献

参考文献3

二级参考文献23

  • 1[1]MEADOR M A.Recent advances in the development of processable high-temperature polymers[J].Annual Review of Materials Science,1998,28:599-630.
  • 2[4]SCHUTZ J B.Hybrid process for resin transfer molding of polyimide matrix composites[C].International SAMPE Technical Conference,2000,32:319-328.
  • 3[5]TIANO T,HURLEY W,ROYLANCE M,Reactive plasticizers for resin transfer-molding of high temperature PMR composites[C].International SAMPE Technical Conference,2000,32:815-829.
  • 4[6]CONNELL J W.Composition of and method for making high performance resins for infusion and transfer molding processes[P].U.S.Pat:6359107 B1,2002.
  • 5[7]CONNELL J W,Jr SMITH J G,Hergenrother P M.High temperature transfer molding resins:laminate properties of PETI-298 and PETI-330[J].High Performance Polymers,2003,15:375-394.
  • 6[8]CRISSJM,CONNELL J W,SMITHJR J G,et al.Resin transfer molding and resin infusion fabrication of high-temperature composites[J].SAMPE Journal,2000,36(3):32 -41.
  • 7[9]SMITHJR J G,CONNELL J W,LI C J.PETI-298 Prepared by Microwave Synthesis:Neat Resin and Composite Properties[C].36th International SAMPE Technical Conference,2004.
  • 8[10]FANG X M,XIE X Q,SIMONE C D.Solid-state 13CNMR study of the cure of 13C-labeled phenylethynyl endcapped polyimides[J].Macromolecules,2000,33 (5):1671-1681.
  • 9[1]Rikio Yokoto,Syougo Yamamoto,Shoichiro Yano,et al.Molecular Design of Heat Resistant Polyimides Having Excellent Processability and Glass Transition Temperatue[J].High Perform Polym,2001,13,61-72.
  • 10[2]Hinkley J A.DSC Study of The Cure of a Phenylethynyl-terminated Imide Oligomer[J].J Adv Mat,1996,55-59.

共引文献33

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部