摘要
电路板在装配调试过程中,时常发生元器件损坏或失效的现象,这时就必须将该元器件解焊下来。为确保各类元器件从电路板上顺利解焊下来,且不损伤印制电路板,返修前应对印制电路板的特点、元器件特点进行透彻了解,再制定合适的返修方法。论文针对典型封装元器件特点进行了详细的介绍,深入分析了集成电路典型返修工艺方法。
In the process of assembling and debugging the circuit board, the damage or invalidation of the component often occurs,and at this time, the component must be unwelded. In order to ensure that all kinds of components can be successfully unwelded from the circuit board and do not damage the printed circuit board,the characteristics of PCB and components should be thoroughly understood before reworking, and then appropriate rework methods should be worked out.In this paper, the characteristics of typical marked components are introduced in detail, and the typical rework process of integrated circuits is deeply analyzed.
作者
吴义勇
WU Yi-yong(Guizhou Aerospace Control Technology Co. Ltd., Guiyang 550009, Chin)
出处
《中小企业管理与科技》
2018年第13期133-134,共2页
Management & Technology of SME
关键词
封装元器件
返修
拆卸
marked component
rework
unweld