化学机械磨削(CMG)加工单晶硅片

Introduction of Chemical Mechanical Grinding ( CMG) on Single Crystal Silicon Wafer

单晶硅是半导体行业重要的功能材料,加工时首先被切割成晶片,然后通过研磨和抛光获得光滑表面。本文介绍了一种新的化学机械磨削(CMG)工艺,用于硅片的终端加工。CMG是把化学反应和机械磨削融为一体的固结磨料加工工艺,在加工效率、磨粒可控性、废料处理等方面优于化学机械抛光(CMP)。利用CMG加工单晶硅片,能有效减小亚表面损伤和消除残余应力,对碳化硅、氮化硅、蓝宝石等其它功能材料的超精密加工具有一定的借鉴意义。

Single crystal silicon is an important functional material in the semiconductor industry. For Si wafer manufacturing,the silicon ingot is first sawn into wafers,each of which then undergoes lapping（ or grinding）,etching and several steps of polishing to remove the mechanical imperfection and to achieve mirror surfaces. This review introduced a new Chemo-Mechanical Grinding（ CMG） process for effective wafer finishing. Chemo-mechanical-grinding（ CMG） is a fixed abrasive process by integrating both chemical reaction and mechanical grinding into one-stop process,shows advantages against CMP in finishing efficiency,geometric controllability and waste disposal,and is applicable to subsurface damage removal and stress relief for silicon,silicon nitride,and silicon carbide,sapphire and other single crystal wafers.