电子器件冷却用散热器的结构形式与研究进展

Configurations and Research Progress of Heat Sinks for Electronic Device Cooling

散热器是电子器件散热或冷却的主要部件之一,散热器结构形式的设计与参数选取直接影响到散热效果。目前,电子器件常用的散热器有柱状翅片散热器、矩形通道散热器、锯齿形翅片散热器和液体冷却散热器等几种。散热器流动与换热的研究是进行结构参数优化及新型散热器研制的基础,而结构参数优化可减小散热器的体积,节省材料,提高散热效果。为解决一些发热量周期性变化或间隙性工作的电子器件散热问题,相变材料被应用到散热器中。此外,微通道可有效解决高热流密度电子器件或芯片的散热问题,但微通道流动压降较大,因此如何减小流动压降成为微通道散热器设计的一个关键。

Heat sink is one of the key components for heat dissipation of electronic device or electronic cooling.The design of configuration types and selection of parameters are directly related to the effect of heat dissipation.Pin-fin heat sinks,plate-fin heat sinks,heat sinks with zigzag channels,and liquid-cooling heat sinks are several heat sinks which are often used.Research on fluid flow and heat transfer is the basis for optimization of configuration parameters.Configuration parameter optimization can reduce the size of heat sinks,save materials and improving heat dissipating.In order to resolve heat dissipation issues for electronic devices working periodically or intermittently,phase change materials are used in heat sinks.In addition,microchannel heat sinks are used for high heat flux heat dissipation for electronic devices or chips.However,pressure drop for flow in microchannel is large and how to reduce pressure drop becomes a key issue for the design of microchannel heat sinks.