基于Moldflow的后盖CAE流动方案优化分析

Analysis of CAE Flow Scheme of Back Cover Based on Moldflow

以后盖为研究对象,阐述了产品的网格划分与MPI方案热流道的创建过程,介绍了MPI方案选材与基本成型条件,采用两种方案对产品的填充过程进行了模拟和分析,通过Moldflow软件对产品的变形和熔接痕进行了对比分析,最终选取方案2对产品成型进行优化分析,得到了一套切实可行的产品成型方案。研究表明,采用计算机辅助技术(CAE分析)对产品的成型优化具有较大的实用价值。

With the cover as the research object, the mesh generation and the process of creating hot runner in MPI schemewere elaborated, the MPI scheme selection and basic forming condition were introduced. Two kinds of schemes were used to simulate and analyze on the filling process of products, and the deformation and weld line of the product were analyzed through Moldflow software. Finally, the scheme 2 was selected to optimize the product molding, and a feasible product forming scheme was obtained. The results shows that the application of computer aided technology is of great practical value to the optimization of product molding.