基于CT技术的金属键合引线三维测量专用夹具

A Special Fixture for Three-dimensional Measurement of Metal Bonding Wire based on CT Technology

准确测量金属键合引线三维形貌,进而通过仿真方式获得键合引线S参数,是评估键合引线对器件级联工艺影响的重要手段。X射线电子计算机断层扫描技术是进行级联电路芯片中金属键合引线测量的有效工具,但是由于级联电路芯片中的键合引线材料、形状、尺寸的特殊性,需要研究专用的夹具提升测量准确度,本文通过结构优化、材料筛选,设计出一种更加稳定、准确度更高的新型测量夹具。

The accurate measurement of the three-dimensional appearance of metal bonding wire and the simula-tion of the S parameters of bonded wire are important means to evaluate the influence of bonding wire on device cascadeprocess. X ray computed tomography is an effective tool for measuring metal bonding wire in cascaded circuit chip. Due tothe particularity of material, shape and size of bonding wire in cascade circuit chip, we need to design a special fixture toimprove the measurement accuracy. In this article, a new type of measuring fixture with more stable and higher accuracy isdesigned by structural optimization and material screening.