火试金法测定废电路板中的金和银量

Measurement of Gold and Silver Contents in Waste Printed Circuit Boards with the Fire Assay Method

研究建立了火试金富集—重量法测定废电路板中金量、硫氢酸钾滴定法测定废电路板中银量的方法,通过优化试验条件,进行了精密度和准确度试验,其金、银相对标准偏差(RSD,n=7)分别为1.41%~4.35%和1.57%~2.86%,金、银的加标回收率分别为96.2%~103.2%和94.9%~99.3%,能有效地满足废电路板中金、银含量的分析需要。

The study establishes a fire assay concentration method, that is, the gravimetric method to measure the gold contents in waste printed circuit boards and the potassium hydrogen sulfate titration method to measure the silver contents in waste printed circuit boards. With optimized test conditions, the precision and accuracy tests have been done. The relative standard deviation （RSD, n=7）of gold and silver is 1.41%-4,35% and 1.57%-2.86% respectively. The recovery of gold and silver is 96.2%-103.2% and 94.9%-99.3% respectively. It can effectively meet the requirements to analyze gold and silver contents in waste printed circuit boards.