原位测量固体材料热导率的改进热探针方法

An Improved Hot Probe Method to Measure Thermal Conductivity of Solid Materials in Situ

热导率是一个重要的热特性参数,它的测量方法包括稳态法和瞬态法。然而,各测量方法由于接触界面均存在非完美热接触,导致接触热阻无法忽略,进而降低热导率测量的准确性。于是,本研究提出了一种改进的热探针方法,即原位浇筑单针法,来降低接触热阻的影响。同时我们还采用了另外四种常用的热导率测量方法测量六种材料的热导率。并且,为了研究接触热阻对热导率测量的影响,我们采用了涂抹导热硅脂的双针法和单针法测量材料热导率。研究表明,原位浇筑单针法的测量结果与其它四种方法热导率的测量结果相一致,并且,原位浇筑单针法可以有效地减少接触热阻,从而提高热导率测量的准确度。

Thermal conductivity is a key element of thermal properties, and thermal conductivity measurement mainly contains steady method and transient method. However, the existence of thermal contact resistance would influence measurement accuracy of thermal conductivity in all these methods.Hence, an in situ hot probe method was used to reduce the effect of thermal contact on thermal conductivity measurement and then had a higher measurement accuracy of thermal conductivity. At the same time, we measured six materials by using other four commonly used methods. Besides,in order to study the effect of contact resistance on thermal conductivity measurement, we used dual probe and single needle methods with thermal paste for measuring thermal conductivity of materials. The results showed that the thermal conductivity measurement of in situ hot probe and the other four methods was consistent, and in situ hot probe can effectively reduce the contact resistance. Thus the new method can improve the accuracy of thermal conductivity measurement.