高速传输中印制电路基板电学性能的研究

Electrical properties of laminates for printed circuit during high-speed transmission

文章采用扫描电子显微镜、3D激光显微镜等研究了几种常用高速基板材料铜箔表面形貌、表面粗糙度等,采用矢量网络分析仪研究了基板材料基本特性,诸如铜箔粗糙度、基板介电性能、以及树脂含量等,获得印制电路基板材料的介电性能及高速传输信号损耗随频率变化的关系与规律,可为高频高速印制电路制造的基板材料选择提供指导。

This paper contains research about surface morphology and roughness of several commonly used high-speed copper foil substrate material by using the methods like SEM （scanning electron microscope） and 3D laser microscope. In order to obtain the relationship and rule between electrical properties of PCB （printed-circuit board） substrate material and the loss of high-speed signal transmission, the efects of basic characteristics of substrate material （such as roughness, dielectric properties and resin content） which have the loss of printed transmission line signal have been analyzed through vector network analyzer. It can provide guidance for the selection of substrate material of high frequency and high speed PCB.