覆盖膜溢胶量的影响因素

Influence Factor of Resin Flow

溢胶量,是表征覆盖膜胶层流动性的一个指标。对于挠性印制电路板的制造来说,覆盖膜的溢胶量表现起到至关重要的作用。本文研究了覆盖膜溢胶量的影响因素,从而为挠性印制电路板的加工提供一些技术支持。

Resin fow is an index to characterize the fuidity of cover lay flm. For the manufacture of fexible print circuit boards, the resin fow of cover lay flm plays an important role in the performance. This article is set to research the influence factor of resin flow of cover lay film, and it provides some technical supports for the processing of fexible print circuit board.