表贴玻封二极管失效问题探讨

Discussion on Failure Problem of Glass Sealed Surface Mount Diodes

针对表贴玻封二极管本体开裂导致产品失效的问题,探讨了表贴玻封二极管的封装结构构成情况、常见失效模式及导致原因、失效机理及装联应对措施、表贴玻封二极管的常见检验方法,为进一步提高表贴玻封二极管的装联可靠性提供有益的依据。

In order to solve the problem of the cracking of the glass sealed surface mount diodes, this paper describes the package structure, the common failure modes and their causes, failure mechanism and the assembly measures, and also the inspection methods of the glass sealed surface mount diodes. It can provide a useful basis for further improving the assembly reliability of the glass sealed surface mount diodes.