摘要
采用真空扩散焊接技术进行了铜及铜合金焊接工艺试验,研究了焊接温度、保温时间、焊接压力、镀层(Ni)对接头界面组织及性能的影响,并测量分析了接头金相、力学性能与显微硬度。结果表明:通过镀镍有效消除了零件表面粗糙度带来的不利影响,提高了扩散界面的接触面积,焊合率超过95%;连接界面铜与镍扩散充分且均匀;接头拉伸强度与母材等强,断口位于母材侧,为韧性断口。
Pure copper and copper-alloy welding experiments were carried out by vacuum diffusion welding technology. The influences of the welding temperature, time, stress and coating（Ni） on interface structure and properties were studied. The microstructure, mechanical properties and the micro-hardness of the joints were measured and analyzed. The results showed that the nickel plating decreased the influence of the surface roughness and enlarged the contact area of the diffusion interface; the bonding rate of the nickel plating joints reached 95%; the diffusion of copper-Ni was equable; the tensile samples always fracture on the pure copper base metal.
作者
刘敏
杨自鹏
张丽娜
郭博闻
王华宾
李跃
Liu Min1,Yang Zipeng2 ,Zhang Lina1, Guo Bowen1, Wang Huabin1 ,Li Yue1(1. Capital Aerospace Machinery Co., Ltd., Beijing 100076; 2. Beijing Institute of Astronautical Systems Engineering, Beijing 10007)
出处
《航天制造技术》
2018年第2期49-51,56,共4页
Aerospace Manufacturing Technology
关键词
真空扩散焊
焊接工艺
铜及铜合金
界面组织
性能
vacuum diffusion welding
welding technology
copper and copper-alloy
interface structure
properties
