微孔电阻测试局限性解决方案

Micro-hole Resistance Test limitations Solution

通过金相剖切测出孔壁镀铜数据,结合孔电阻计算公式算出理论电阻,与微孔电阻测试实测数据进行比对,对测试数据进行离散性分析,确定微孔电阻测试的局限性;针对这种局限性,结合生产实际提出微孔电阻测试离散数据偏离参考值,进行X光无损检测确认;改进工艺,减少缺陷的发生。

Through measuring the thickness of plating hole by microsection, we calculate the theory hole resistance with the hole resistance formula, compare the measured data, analyze the discreteness of the test data and find the limitations of micro-hole resistance test; in view of the limitations, combined with the practical production of micro-hole resistance test, we propose a reference value of discrete data. If it exceed the reference range, we will perform an X-ray inspection; we will analyze the causes of the defect by microsection and adopt process improvement in order to reduce the occurrence of defects.