摘要
采用固-液法快冷成型制备了Cu/Al整体材料。利用SEM,EDS,XRD等分析了Cu/Al界面的微观结构和相组成,基于扩散方程并结合相图定量分析了Cu/Al界面组织演化过程。结果表明:从Cu侧至Al侧,界面依次形成了区域Ⅰ(AlCu+Al_2Cu)混合组织,过共晶组织[Al_2Cu+(Al_2Cu+α-Al)]的区域Ⅱ和亚共晶组织[α-Al+(Al_2Cu+α-Al)]的区域Ⅲ;随着界面Cu浓度的变化,Al_2Cu相具有不同形貌;且各个区域厚度同理论值基本一致。
The Cu/Al diffusion couples were prepared by a solid-liquid bonding method. Interfacial microstructure and phase composition were investigated by scanning electron microscope（SEM）, energy dispersive spectrometry（EDS） and X-ray differential（XRD）. Moreover, the microstructural evolution of Cu/Al interface was quantitatively analyzed on the basis of diffusion theory and phase diagram. The results reveal that the interface consists of I（AlCu＋Al2Cu）, hypereutectic microstructure Ⅱ [Al2Cu＋（α-Al＋Al2Cu）] and hypoeutectic microstructure Ⅲ[α-Al＋（α-Al＋Al2Cu）] from Cu side to Al side accordingly. Further, there are various morphologies of Al2Cu phase formed with the decreasing of Cu concentration. Additionally, the thickness of three diffusion zones is basically identical with the theoretical prediction.
作者
王婵
梁淑华
邹军涛
姜伊辉
杨卿
Wang Chan;Liang Shuhua;Zou Juntao;Jiang Yihui;Yang Qing(Xi＇an University of Technology, Xi＇an 710048, China;Shaanxi Province Key Laboratory of Electrical Materials and Infiltration Technology, Xi＇an 710048, China)
出处
《稀有金属材料与工程》
SCIE
EI
CAS
CSCD
北大核心
2018年第4期1037-1042,共6页
Rare Metal Materials and Engineering
基金
National Natural Science Foundation of China(51371139,51174161)
the Science and Technique Innovation Program of Shaanxi Province(2012KTQ01-14)
the Pivot Innovation Team of Shaanxi Electric Materials and the Infiltration Technique(2012KCT-25)
关键词
CU/AL
固液界面
扩散方程
组织演化
Cu/Al alloy
solid-liquid interface
diffusion equation
microstructural evolution
