锡膏检测(SPI)中摄像机走位算法设计

Design of Camera Positioning Algorithm in Solder Paste Inspection

在工业视觉检测中,摄像机的视野尺寸远远小于印制电路板的尺寸,单个视野下无法满足整个电路板上锡膏的检测,需要移动摄像机(称为摄像机走位)进行多次拍摄。在传统检测中,对印制电路板进行整版扫描和拍摄(即使无锡膏的位置),降低了锡膏的检测效率。针对此情况,提出一种解决方案:通过电路板上锡膏的定位数据,搜索满足所有待检测锡膏都包含在摄像机视野内的最少摄像机视野数,并记录每个视野的中心位置,然后计算中心位置之间的最短移动路径,最后以此路径作为锡膏检测的摄像机移动路径。实验表明,与传统方法相比,文中提出的方法避免了无锡膏位置的拍摄,提高了检测速度,降低了检测成本。

In industrial vision inspection, the field of view of the camera is much smaller than the size of the printed circuit board. A single field of view cannot meet the inspection of the solder paste on the entire circuit board. The camera needs to be moved to take multiple shots, which is camera positioning. In conventional inspection, a full-length scanning and photographing of the printed circuit board is performed, and even if there is no solder paste, the solder paste inspection efficiency is reduced. In view of this situation, a solution is proposed. At first,searching for the minimum number of camera views that satisfy all the solder pastes included in the field of view of the camera through the solder paste positioning data on the circuit board. The center position of each field of view is recorded. And then, the shortest movement path between the center positions is calculated. At last, the path is used as the solder paste inspection camera movement path. Experiments show that compared with traditional methods,the proposed method avoids the shooting of the solder paste position, improves the inspection efficiency and reduces the inspection cost.