接地端热传导对聚酰亚胺内带电的影响

Infiuence of ground heat conduction on inner charging of polyimide

提出局部接地和传热模式下介质深层充电的建模方法,选取常用聚酰亚胺材料模拟空间高能带电粒子的辐照情况,研究了局部接地和传热情况下介质的深层充电特性。仿真结果表明:温度在183.15～363.15 K范围时,电位峰值受接地铜板直径和接地端温度的影响较大;温度在183.15～273.15 K范围时,场强峰值受接地铜板直径和接地端温度的影响较大;温度在273.15～363.15 K范围时,场强峰值受接地铜板直径和接地端温度的影响较小,但仍存在放电风险,场强峰值接近甚至超过10~6 V/m。仿真结果为星用热控材料的合理布局及太阳电池阵玻璃盖片的热防护和带电防护提供了参考。

A modeling method of deep dielectric charging in local grounding and heat transfer mode is proposed. Commonly used polyimide materials are selected to simulate irradiation of high energy charged particles in space, and deep charging characteristics of dielectric in local grounding and heat transfer are investigated. Simulation results show that when the temperature ranges from 183.15 K to 363.15 K, the peak electric potential is influenced by the diameter and temperature of the grounding plate. When the temperature ranges from 183.15 K to 273.15 K, the peak field strength is largely influenced by the diameter and temperature of the grounding plate. When the temperature ranges from 273.15 K to 363.15 K, the peak field strength is less influenced by the diameter and temperature of the grounding plate, but there is still discharge risk, and the field strength peak is close to or even more than 106 V/m. Simulation results can provide a reference for the reasonable layout of the thermal control materials and thermal protection and charging protection of solar cell array glass cover sheet.