塑封料配方优化解决SOT产品芯片破裂问题的研究

Research On Formula Optimization Of Mold Compound To Solve SOT Shear Die Issue

内部芯片破裂会导致SOT产品功能性失效的问题,长期以来该问题的研究方向始终集中在前道的工艺生产上而不能被彻底解决。最新研究发现该失效与后道生产工艺有着非常直接的联系。作者及其团队通过仿真模拟分析确立了芯片破裂的失效机理,经过一系列的实验研究与对比分析后发现塑封料自身的黏附力对芯片破裂有着极其重要的影响,最终通过对塑封料配方的优化实现了塑封料与芯片黏附力的大幅提升,成功解决了SOT产品内部芯片破裂的问题。

Shear die will lead to SOT product functional failure, the former study focused on the FOL process of all the time but without problem solving. The latest study shows that the failure is mainly caused by EOL process. The writer and his team worked out the failure mechanism with Finite Element Analysis, further study also indicated that the resin adhesion is significantly important to shear die occurrence, the problem was finally successfully solved via com- pound formula optimization.