LD芯片贴片机顶针机构的改进

Improvement of Push Needle Mechanism of LD Die Bonder

为了解决LD芯片贴片机顶针机构的顶针容易断裂以及调试难度较大的问题,通过对原顶针机构工作原理的分析,阐述了原顶针结构存在问题的原因;为了进一步提高设备的稳定性,对原机构进行了改进设计。通过客户现场的大量生产验证和对比,新顶针机构对不同材质蓝膜的适应性非常好,进一步提高了贴片机的稳定性。

In order to solve the problem that the push needle of the LD die bonder is easily broken and the mechanism is difficult to debug,the reason for the problems of the original mechanism structure was expounded through analyzing the working principle of the original mechanism. Therefore,the original mechanism must be redesigned to improve the stability of the machine. Through the mass production verification and comparison,it was proved that the new mechanism is adapted to different blue tape and the stability of the machine is greatly improved.