贴片式LED支架包脚成型技术

Pin Forming Technology of SMD LED Frame

介绍了贴片式LED支架包脚成型技术;分析了LED支架包脚成型的设计要点,指出了冲切成形工艺下可能产生的缺陷,并提出了解决方法。通过多次弯角的方式实现支架的包脚成型,可以有效减小料片与成形零件之间的接触面积和接触时产生的摩擦力,减小成型时对引线脚造成的擦伤。产品成形后进行整形处理,可以有效控制产品的成形尺寸和平面度。

The corner wrapping technology of SMD LED frame is introduced in this paper. This paper analyses the key design points of LED frame corner wrapping technology,points out the possible defects under punching and wrapping process,and proposes a solution. The corner wrapping of LED frame is conducted through multiple bending method,which can effectively reduce the contact area and friction force between material sheets and frame parts,resulting in less abrasion damage on lead pins during the process. The product shape can still be modified to control size and flatness of final product after the framing process.