氮化硼/聚合物导热复合材料的进展

Progress on Boron Nitride/Polymer Thermally Conductive Composite

随着电子技术的快速发展,电子产品越来越小型化,很多部件被集中在1个很小的空间,同时器件会产生大量的热量,这些热量需要通过器件的封装材料及时导出,否则会影响设备的性能,因此封装材料应具备良好的导热性能。目前,成本低廉且性能优异的聚合物基导热复合材料受到了广泛的关注,尤其是以氮化硼(BN)为导热填料的聚合物基复合材料备受关注,这是由于BN具有高导热性,并且在空气中的热稳定性也较高,使其在导热领域内具有潜在的应用。BN的应用领域广泛,可压制成各种形状的BN制品,用作高温、高压、绝缘、散热部件,还可用作航天航空业中的热屏蔽材料等。很多因素都可以影响BN的导热性能,文章主要从BN的形貌、表面改性、在基体中的取向以及杂化等方面介绍了近年来BN/聚合物导热复合材料的研究进展。

As the rapid development of electronic technology, electronic products become more and more miniaturization, more parts are concentrated in a small space, so the device will produce a lot of heat, the heat of the device through the packaging material timely export, otherwise it will affect the performance of the device, Therefore, the packaging material should have good thermal conductivity. At present, the low cost and excellent performance of the polymer-based thermal composite materials have been widespread concern, in particular, polymer-based composite with boron nitride（BN） as thermal conductiw- fillers have attracted much attention. The reason is that the BN has a high thermal conductivity, and the thermal stability in the air is also high, which makes BN have a potential application in the field of thermal conductivity. BN has a wide range of applications. It can be made into BN products of various shapes. It can be used as high temperature, high pressure, insulation and heat dissipation components. It can also be used in the thermal shielding materials of the aerospace industry. Many factors can affect the thermal conductivity of BN, the progress of BN/polymer thermal conductive composite in recent years is introduced mainly from the morphology of BN,surface modification of BN, orientation in the matrix of BN and hybrid and other aspects.