压力对交联聚乙烯-硅橡胶界面电痕破坏碳化深度的影响

Influence of Pressure on Carbonization Depth by Tracking Failure for Composite Interface of Cross-linked Polyethylene and Silicone Rubber

为了研究界面压力对电痕破坏的影响规律,以电缆专用交联聚乙烯-硅橡胶薄片叠压的复合界面为实验样品,建立了界面压力可调的电痕破坏实验平台,采集并分析了界面压力与复合界面电痕破坏碳化深度分布的数量关系,得到了界面压力对交联聚乙烯碳化分布的影响规律,并探讨了其影响机理。结果表明:界面压力越小,复合界面上交联聚乙烯表面的碳分布面积越大,碳化深度越浅;界面压力越大,交联聚乙烯表面的破坏面积越小,碳化深度越深。这种结果可能是界面中存在微气隙,这些微气隙具有一定的绝缘自恢复性,且对压力敏感以及微气隙的绝缘强度比固体有机绝缘低的缘故。

In order to study the effect of interface pressure on the tracking failure, composite interface of XLPE and SIR laminates of cables was studied via a tracking failure experiment platform with adjustable interface pressure, the quantitative relationship between the interface pressure and the carbonization depth distribution of tracking failure was analyzed. The effect of interface pressure on carbonization distribution of XLPE was obtained and its mechanism was also discussed. The results show that the lower the interface pressure, the larger the distribution area of carbonization on the XLPE surface on the composite interface and the more shallow the carbonization depth. While the larger the interface pressure, the smaller the damage area on the XLPE surface, and the deeper the carbonization depth. This result may due to the existence of micro air-gap on the interface, which has a certain self-recover performance of insulation and is sensitive to pressure, and the insulation strength of the micro air-gap is lower than that of solid organic insulation.