紫外皮秒激光参数对镍铁合金微孔加工的影响

Effects of UV-picosecond laser parameters on micro-hole drilling of ni-fe alloy

微孔是半导体、高精密部件的重要组成部分。皮秒激光的超短脉冲宽度、极小的热传递和高性价比特性使得其在微细加工方面具有独特的优势和广泛的应用前景。然而对于直径100μm以下微孔的加工,普遍存在微孔直径较大,微孔锥度大,存在加工影响区域等问题。采用脉冲宽度10ps,波长343nm紫外激光在镍铁合金上进行激光微孔打孔研究。通过前期实验分析,微孔加工过程的排屑问题是微孔成型质量的关键。提出了悬空加工工艺以改善激光打孔的排屑能力,并设计夹具实现材料悬空,提高激光打孔的微孔质量。实验结果表明,悬空加工方法增大了微孔出口直径,减小约2°的微孔锥度。并且在此基础上研究皮秒激光参数对微孔直径、锥度的影响关系。实验结果表明,激光脉冲能量、脉冲频率对微孔直径、锥度存在较大影响,单次叩击加工时间、加工次数对直径影响较小,但是具有改善微孔形貌的作用。通过选择合适的激光参数和悬空工艺,实现了直径32μm的微孔加工。

Micropores are an important part of semiconductors, high-precision components. The ultra-short pulse width of the picosecond laser, the extremely small heat transfer and the Cost-effective make it have unique advantages and broad application prospects in micro-fabrication. However, for the processing of micropores with a diameter of less than 100p, m, the problems of large microporc diameter, large micropore taper and the influence of processing area exist. The study of laser microporous drilling was performed on the nickel-iron alloy with a pulse width of 10 ps and a wavelength of 343 nm UV laser. Through the preexperiment analysis, the microhole processing chip discharge problem is the key to the quality of micro-hole forming. The dangling processing technology is proposed to improve the chip removal ability of laser drilling, and the fixture is designed to float and increase the mieropore quality of laser drilling. The experimental results show that the hanging processing method increases the diameter of the micropore outlet and reduces the micropore taper of about 2°. Based on this, the influence of picosecond laser parameters on the pore diameter and taper is studied. The experimental results show that the laser pulse energy and pulse frequency have great influence on the diameter and taper of the micropore. The processing time and processing times have little effect on the diameter, but have the effect of improving the micropore morphology. By selecting the appropriate laser parameters and floating process, to achieve a diameter of 32 μm microporous processing.