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Thermal and Mechanical Properties of Epoxy Resin Modified with N-(4-hydroxyphenyl)terahydrophthalic Anhydrideimide

Thermal and Mechanical Properties of Epoxy Resin Modified with N-(4-hydroxyphenyl)terahydrophthalic Anhydrideimide
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摘要 A novel epoxy-imide resin based on diglycidyl ether of bisphenol-A and N-(4-hydroxyphenyl)terahydrophthalic anhydrideimide(HTAM) was synthesized. The structural characterization of the epoxy-imide resin was conducted by FT-IR spectra. 4,4'-diaminodiphneylmethane(DDM) was used as a curing agent for the epoxy-imide resin. The thermal properties of the cured resin were evaluated with dynamic mechanical analyses(DMA) and thermogravimetric analysis(TGA). The results showed that the cured resin exhibited a high glass transition temperature(Tg) of 186 ℃ when the molar amount of HTAM was 0.04 mol in the resin. The yields of the cured resin at 800 ℃ raised from 16.45% to 19.41%. The flexural properties were also measured, the flexural strength raised from 79.4 to 95.7 MPa, and the flexural modulus exhibited from 2.6 to 3.0 GPa. A novel epoxy-imide resin based on diglycidyl ether of bisphenol-A and N-(4-hydroxyphenyl)terahydrophthalic anhydrideimide(HTAM) was synthesized. The structural characterization of the epoxy-imide resin was conducted by FT-IR spectra. 4,4'-diaminodiphneylmethane(DDM) was used as a curing agent for the epoxy-imide resin. The thermal properties of the cured resin were evaluated with dynamic mechanical analyses(DMA) and thermogravimetric analysis(TGA). The results showed that the cured resin exhibited a high glass transition temperature(Tg) of 186 ℃ when the molar amount of HTAM was 0.04 mol in the resin. The yields of the cured resin at 800 ℃ raised from 16.45% to 19.41%. The flexural properties were also measured, the flexural strength raised from 79.4 to 95.7 MPa, and the flexural modulus exhibited from 2.6 to 3.0 GPa.
出处 《Journal of Wuhan University of Technology(Materials Science)》 SCIE EI CAS 2018年第3期744-748,共5页 武汉理工大学学报(材料科学英文版)
基金 Funded by the National Natural Science Foundation of China(No.51572205) the National Natural Science Foundation of Hubei Province,China(No.2014CFB854) the Equipment Pre-Research Joint Fund of EDD and MOE(No.6141A02033209)
关键词 epoxy-imide resin glass transition temperature char yield flexural properties epoxy-imide resin glass transition temperature char yield flexural properties
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  • 1Guo, Q.P., Polymer, 1995, 36(25): 4753.
  • 2Lin, M.S., Liu, C.C. and Lee, C.T., J. Appl. Polym. Sci., 1999, 72(4): 585.
  • 3Denq, B.L., Hu, Y.S., Chen, L.W., Chiu, W.Y. and Wu, T.R., J. Appl. Polym. Sci., 1999, 74(1): 229.
  • 4Kaji, M., Nakahara, K. and Endo, T., J. Appl. Polym. Sci., 1999, 74(3): 690.
  • 5Tan, C.B., Sun, H., Fung, B.M. and Grady, B.P., Macromolecules, 2000, 33(17): 6249.
  • 6Bonnet, A., Pascault, J.P., Sautereau, H. and Camberlin, Y., Macomolecules, 1999, 32(25): 8524.
  • 7Wang, M.H., Yu, Y.F., Wu, X.G. and Li, S.J., Polymer, 2004, 45(4): 1253.
  • 8Hedrick, J.L., Russell, T.P., Haidar, B. and Yang, A.C.M., Macromolecules, 1989, 22(12): 4470.
  • 9Li, Y.W., Shen, M.M., Huang, H.Y., Ma, Y.J. and Ha, C.Y., Acta Polymerica Sinica(in Chinese), 2009, (11): 1086.
  • 10Francis, B., Thomas, S., Jose, J., Ramaswamy, R. and Lakshmana Rao V., Polymer, 2005, 46(26): 12372.

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