无铅QFP金属间化合物层的高温可靠性研究

Reliability Analysis of Intermetallic Compound of Lead-free QFN Packages in Mixed Assembly

QFP封装由于具有良好的电和热性能、体积小、质量轻,在电子产品中被越来越广泛地推广和应用。针对混装工艺中的无铅QFP的可靠性,开展了高温存储、高压蒸煮和高温高湿试验,分别考察不同条件下金属间化合物层厚和结构的变化及其对剪切强度的影响。

QFP（quad flat package） packing has been widely promoted and applied in the electronic products because of good electrical and thermal performance, small volume and light weight. Three types of reliability test such as high temperature storage test, high-pressure heating test and high temperaturehumidity test were introduced for observe influences on reliability of QFP used for mixed assembly. Differences between thickness and changes of configuration of intermetallic compound in those three environments were observed. The relationship between those and shear strength also was discussed.