摘要
对比研究了不同时效温度下Sn-58Bi和Sn-58Bi-0.5Ce钎焊接头的组织、界面IMC形态、厚度及接头拉伸性能和断口形貌。结果表明：Ce颗粒的添加细化了Sn-58Bi钎料的组织,抑制了Sn-58Bi钎料接头时效过程中组织的粗化、IMC形貌变化及厚度的增大。随时效温度的升高,Cu/Sn-58Bi-0.5Ce/Cu钎焊接头IMC形貌从扇贝状逐渐趋于平整,厚度逐渐增大,抗拉强度逐渐降低,拉伸断口由韧性断裂转变为脆性断裂。
The microstructure,interface IMC morphology,thickness and solder joints tensile properties and fracture morphology of Sn-58 Bi and Sn-58 Bi-0. 5 Ce solder were comparatively studied at different aging temperature. The results show that the microstructure of Sn-58 Bi solder is refined by adding Ce particles,the coarsening of the microstructure of Sn-58 Bi solder joint,the change of the IMC morphology and the increase of the thickness during aging are inhibited. With the increase of aging temperature,the interface IMC morphologies is gradually changed from scallop to a relatively flat layered structure,the thickness is increased,the tensile strength of the solder joints is decreased,and the fracture is changed from ductile fracture to brittle fracture.
作者
周仕远
杨莉
朱路
宋兵兵
Zhou Shiyuan;Yang Li;Zhu Lu;Song Bingbing(School of Mechanical Engineering, Changshu Institute of Technology, Changshu Jiangsu 215500, China;School of Mechatronic Engineering, Soochow University, Suzhou Jiangsu 215500, China)
出处
《金属热处理》
CAS
CSCD
北大核心
2018年第6期96-99,共4页
Heat Treatment of Metals
基金
国家自然科学基金(51505040)
