芯片散热微通道仿生拓扑结构研究

A Study of Bionic Micro-channel Topology for Chip Cooling

为提升高热流密度芯片的散热能力,借鉴自然界中众多具有优良传质传热特性的网络拓扑,设计了多种仿生微通道拓扑结构.利用数值模拟方法,分析了不同拓扑结构的散热效果及压降特性,结果表明不同拓扑结构的散热能力存在一定差异,且芯片热流密度越高差异越明显.对数值分析中综合性能优秀的蜘蛛网结构的散热特性进行了理论分析,并通过3D打印加工了微通道散热器,测试表明其散热能力和压降相对现有平直微通道均有明显提高.

In order to improve the heat dissipation capacity of chip with high heat flux density,this paper presents some bionic micro channel topologic structures which are designed based on natureral network topologies with excellent heat and mass transfer characteristic.Then the heat dissipation and pressure drop of different topologies are analyzed by numerical simulation.The calculation results indicate that there exists differences in the heat dissipation capacity of different topologies.With the increasing of heat flux density,the differences become more obvious.The heat dissipation characteristics of the spider web structure with excellent performance are analyzed theoretically.The micro-channel heat sink is fabricated by 3D printing.The testing results indicate that the heat dissipation capacity of the spider web structure has a better performance than current existing flat micro-channel.